ADG709BRUZ-REEL7
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Specification
封装 | TSSOP-16 |
逻辑系列 | ADG709 |
宽度 | 4.4 mm |
高度 | 1.05 mm (Max) |
工作温度范围 | - 40 C~+ 125 C |
安装方式 | SMD/SMT |
电路数量 | 4 Channel |
长度 | 5 mm |
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