HMC584LP5
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Specification
封装 | 5.1 mm*5.1 mm*1 mm |
工作温度范围 | - 40 C~+ 85 C |
高度 | 1 mm |
安装方式 | Solder Pad |
长度 | 5.1 mm |
宽度 | 5.1 mm |
工作电压 | 4.75 V~5.25 V |
主频率 | 12.5 GHz to 13.9 GHz |
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