HSMS-2860-BLKG
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Specification
安装方式 | 贴片 |
封装 | SOT-23 |
资格等级 | AEC-Q200 |
Pd-功率耗散 | 100mW |
峰值反向工作电压VRWM | 4V |
最大工作温度 | +150℃ |
结电容Cj | 0.3pF |
材质 | 硅 |
极性 | NPN |
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