DA14531-00000FX2
Manufacturer:
Mfr. Part #:
DA14531-00000FX2
Allchips #:
R001-DA14531-00000FX2-484-H-20+-X-Y
Description:
RF片上系统 - SoC Bluetooth Low Energy 5.1 SoC with integrated ARM Cortex M0+, memories and peripherals 12 GPIOs in FCGQFN24 and 0.4mm ball pitch package
ECAD Model:
Delivery:
Payment:
PayPal, Credit Card, Wire Transfer, Western Union
In stock
- DA14531-00000FX2 Details
- Packing And Shipping
- Payment Method
- Quality Control
Dialog,DA14531-00000FX2 is available at Allchips.100% original and new guarantee. If
comprehensive data for DA14531-00000FX2 to optimize the supply chain, including costdown, time-saving, cross
references, parametric, counterfeit risk, alternative components, obsolescence management forecasts is expected,
please contact our professional team.
Specification
| 工作频率 | 2.4GHz |
| 射频系列 | 蓝牙 |
| 工作电压 | 1.1V~3.3V |
| 封装 | FCGQFN-24 |
| 类型 | Bluetooth |
| 存储容量 | 48kBRAM，144kBROM |
| 接收灵敏度 | -94dBm |
| 安装方式 | SMD/SMT |
| 接口类型 | ADC，GPIO，I²C，SPI，UART |
| 工作温度范围 | -40°C~85°C |
Others include "DA14531-00000FX2" parts
The following parts include 'DA14531-00000FX2'
DA14531-00000FX2 Releted Information
- Hot sale
- Related Categories
- Popular Search
FEATURED PRODUCT SOMRON
-
-
DA14531-00000FX2
Dialog
RF片上系统 - SoC Bluetooth Low Energy 5.1 SoC with integrated ARM Cortex M0+, memories and peripherals 12 GPIOs in FCGQFN24 and 0.4mm ball pitch package
Learn More >
-
-
DA14531-00000FX2
Dialog
RF片上系统 - SoC Bluetooth Low Energy 5.1 SoC with integrated ARM Cortex M0+, memories and peripherals 12 GPIOs in FCGQFN24 and 0.4mm ball pitch package
Learn More >
-
-
DA14531-00000FX2
Renesas
RF片上系统 - SoC Bluetooth Low Energy 5.1 SoC with integrated ARM Cortex M0+, memories and peripherals 12 GPIOs in FCGQFN24 and 0.4mm ball pitch package
Learn More >
-
View All Newest Products from Omron
