BGA 616 H6327
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Specification
RoHS | yes |
Types | Silicon Germanium MMIC |
working frequency | 0 Hz to 2.7 GHz |
Gain | 18 dB |
NF-noise figure | 2.6 dB |
P1dB - compression point | 18 dBm |
OIP3 - Third-order intercept point | 29 dBm |
Test frequency | 2 GHz |
Operating supply voltage | 6 V |
Working power supply current | 60 mA |
Minimum working temperature | - 65 C |
The maximum working temperature | + 150 C |
Installation style | SMD/SMT |
Package / case | SOT-343-4 |
Pd - Power Dissipation | 360 mW |
Series | BGA616 |
Factory packing quantity | 3000 |
Unit weight | 6.400 mg |
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