BGA825L6SE6327XTSA1
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Specification
RoHS | yes |
Types | RF Silicon Germanium |
working frequency | 1550 MHz to 1615 MHz |
Minimum working temperature | - 40 C |
The maximum working temperature | + 85 C |
Installation style | SMD/SMT |
Package / case | TSLP-6 |
Pd - Power Dissipation | 72 mW |
Series | BGA825L6 |
Factory packing quantity | 15000 |
Technology | SiGe |
Unit weight | 200 mg |
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