MP174GS-Z
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Specification
封装 | SOIC-8 |
工作温度范围 | -40°C~125°C(TJ) |
功能 | Non-Isolated,软启动 |
安装方式 | 表面贴装型 |
电源拓扑 | 升压,降压,降压升压,反激 |
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