PIC18F2525-I/SP
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Specification
封装 | SPDIP-28 |
安装方式 | Through Hole |
ROM类型 | Flash |
CPU内核 | PIC18 |
I/O数量 | 25 I/O |
长度 | 34.67 mm |
宽度 | 7.24 mm |
工作温度范围 | - 40 C~+ 85 C |
工作电压 | 4.2 V~5.5 V |
A/D | 10 bit |
最大主频 | 32 MHz |
RAM大小 | 3.89 kB |
高度 | 3.3 mm |
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