LPC1311FHN33,551
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Specification
I/O数量 | 28 |
封装 | VQFN-32裸露焊盘 |
工作温度范围 | -40°C~85°C(TA) |
安装方式 | 表面贴装型 |
RAM大小 | 4Kx8 |
Others include "LPC1311FHN33,551" parts
The following parts include 'LPC1311FHN33,551'
- lpc1311fhn33/01,55
- lpc1316fhn33
- lpc1316fbd48,55
- lpc1315fbd48,55
- lpc1317fbd64,55
- lpc1311fhn33
- lpc1313fbd48/01,1
- lpc1313fhn3355
- lpc1313fhn33/01,5
- lpc1313fbd48/01,15
- lpc1315fhn33,551
- lpc1315fhn33,55
- lpc1313fbd48,15
- lpc1313fbd48/01
- lpc1317fhn33,551
- lpc1313fbd48,151
- lpc1317fbd48,55
- lpc1313fhn33,55
- lpc1311fhn33/01,5
- lpc1316fhn33,55
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LPC1311FHN33,551
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ARM® Cortex®-M3 LPC13xx 微控制器 IC 32-位 72MHz 8KB(8K x 8) 闪存 32-HVQFN(7x7)
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