LPC55S28JBD100K
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Specification
安装方式 | 表面贴装型 |
封装 | 100-HLQFP(14x14) |
工作温度范围 | -40°C~105°C(TA) |
RAM大小 | 256Kx8 |
I/O数量 | 64 |
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