MC9RS08KA2CDB
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Specification
安装方式 | SMD/SMT |
CPU内核 | RS08 |
工作温度范围 | - 40 C~+ 85 C |
ROM大小 | 2 kB |
高度 | 1 mm |
封装 | DFN-EP-6(3x3) |
RAM大小 | 63 B |
最大主频 | 20 MHz |
A/D | No ADC |
I/O数量 | 4 I/O |
ROM类型 | Flash |
长度 | 3 mm |
宽度 | 3 mm |
工作电压 | 1.8 V~5.5 V |
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