MCIMX6QP5EYM1AB
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Specification
封装 | LFBGA-624 |
安装方式 | SMD/SMT |
工作温度范围 | - 20 C~+ 105 C |
最大主频 | 1 GHz |
RAM大小 | 528 kB |
ROM大小 | 96 kB |
内核数量 | 4 Core |
CPU内核 | ARM Cortex A9 |
工作电压 | 1.05 V to 1.5 V |
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