S9S08SG16E1MTL
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Specification
封装 | TSSOP-28 |
工作温度范围 | - 40 C~+ 125 C |
高度 | 1.05 mm |
长度 | 9.8 mm |
宽度 | 4.5 mm |
CPU内核 | S08 |
工作电压 | 2.7 V~5.5 V |
安装方式 | SMD/SMT |
资格等级 | AEC-Q100 |
RAM大小 | 1 kB |
最大主频 | 40 MHz |
A/D | 10 bit |
I/O数量 | 22 I/O |
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