S9S08SG4E2MTJ
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Specification
RAM大小 | 256 B |
ROM大小 | 4 kB |
工作电压 | 2.7 V~5.5 V |
ROM类型 | Flash |
工作温度范围 | - 40 C~+ 125 C |
最大主频 | 40 MHz |
封装 | TSSOP-20 |
高度 | 1.05 mm |
安装方式 | SMD/SMT |
资格等级 | AEC-Q100 |
A/D | 10 bit |
CPU内核 | HCS08 |
I/O数量 | 16 I/O |
长度 | 6.6 mm |
宽度 | 4.5 mm |
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