S9S08SG8E2MTGR
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Specification
封装 | TSSOP-16 |
I/O数量 | 12 I/O |
A/D | 10 bit |
RAM大小 | 512 B |
最大主频 | 40 MHz |
高度 | 1.05 mm |
安装方式 | SMD/SMT |
工作温度范围 | - 40 C~+ 125 C |
CPU内核 | HCS08 |
资格等级 | AEC-Q100 |
长度 | 5 mm |
宽度 | 4.4 mm |
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