M30873FHBGP#U3
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Specification
封装 | 100-LFQFP(14x14) |
RAM大小 | 24Kx8 |
工作温度范围 | -40°C~85°C(TA) |
I/O数量 | 85 |
安装方式 | 表面贴装型 |
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