STGB10H60DF
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Specification
封装 | D2PAK |
安装方式 | 表面贴装型 |
工作温度范围 | -55°C~175°C(TJ) |
Pd-功率耗散 | 115W |
Vgs - 栅极-源极电压 | 19.5ns/103ns |
晶体管极性 | 沟槽型场截止 |
Vds-漏源极击穿电压 | 600V |
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STGB10H60DF
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IGBT 沟槽型场截止 600V 20A 115W 表面贴装型 D2PAK
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