STGB30H60DLFB

Name: STGB30H60DLFB
Brand: ST Microelectronics
SKU: R001-STGB30H60DLFB-14-H-0000-X-N
Availability: InStock
Rating: 5 (2 reviews)

Manufacturer:

ST Microelectronics

Mfr. Part #:

STGB30H60DLFB

Allchips #:

R001-STGB30H60DLFB-14-H-0000-X-N

Datasheet:

Description:

IGBT 沟槽型场截止 600V 60A 260W 表面贴装型 D2PAK

ECAD Model:

Delivery:

Payment:

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STGB30H60DLFB Details
Packing And Shipping
Payment Method
Quality Control

ST Microelectronics,STGB30H60DLFB is available at Allchips.100% original and new guarantee. If comprehensive data for STGB30H60DLFB to optimize the supply chain, including costdown, time-saving, cross references, parametric, counterfeit risk, alternative components, obsolescence management forecasts is expected, please contact our professional team.

Specification

工作温度范围	- 55 C~+ 175 C
集电极—发射极最大电压 VCEO	600 V
栅极/发射极最大电压	20 V
Pd-功率耗散	260 W
封装	D2PAK-3
安装方式	SMD/SMT
栅极阈值电压-VGE(th)	20 V
集电极电流Ic	60 A

	Ship Fee	Lead Time	Processing Time
DHL	$20.00-$40.00(0.50KG)	2-5 days	Shipping fee depend on different zone and country
UPS	$20.00-$45.00(0.50KG)	2-5 days
TNT	$25.00-$65.00(0.50KG)	2-5 days
EMS	$25.00-$45.00(0.50KG)	4-15 days
Air, Sea/air and Sea	$2.00-$3.00(0.10KG)	7-30 days
FedEX	$20.00-$40.00(0.50KG)	3-7 days