SDINBDG4-8G-XI2
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Specification
封装 | 11.5 mm x 13 mm x 0.8 mm |
接口类型 | e.MMC 5.1 HS400 |
工作电压 | 2.7 V to 3.6 V |
存储容量 | 8 GB |
工作温度范围 | - 40 C~+ 85 C |
安装方式 | SMD/SMT |
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