BGM113A256V21
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Specification
封装 | SMD-36P |
高度 | 1.9 mm |
接口类型 | GPIO, I2C, SPI, UART |
连接器类型 | Integrated |
工作温度范围 | -40°C~85°C(TA) |
长度 | 15.73 mm |
宽度 | 9.15 mm |
模块类型 | Bluetooth Low Energy (BLE) |
输出功率 | 3 dBm |
工作电压 | 3.3 V |
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