BGM13S32F512GN-V3
Manufacturer:
Mfr. Part #:
BGM13S32F512GN-V3
Allchips #:
R001-BGM13S32F512GN-V3-177-H-0000-X-Y
Description:
蓝牙模块 (802.15.1) BGM13S Bluetooth SiP Module, 2.4GHz, 512kB Flash, +18dBm, External Antenna
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Specification
高度 | 1.4 mm |
封装 | 6.5 mm*6.5 mm |
存储容量 | 512kB闪存,64kBRAM |
工作温度范围 | -40°C~85°C |
协议标准 | GFSK |
接收灵敏度 | -102.1dBm |
安装方式 | 表面贴装型 |
长度 | 6.5 mm |
速率 | 2Mbps |
工作频率 | 2.4GHz |
射频系列 | 蓝牙 |
接口类型 | I2C, UART |
工作电压 | 1.8 V to 3.8 V |
输出功率 | 18 dBm |
宽度 | 6.5 mm |
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