1-2199298-2
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Specification
封装 | Through Hole |
安装类型 | 通孔 |
IC/器件类型 | DIP,0.3"(7.62mm)行距 |
针脚数 | 8(2x4) |
脚间距 | 0.100"(2.54mm) |
触点电镀 | 锡 |
行间距 | 0.300"(7.62mm) |
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