66AK2L06XCMS2
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Specification
工作温度范围 | - 40 C~+ 100 C |
高度 | 2.88 mm |
安装方式 | SMD/SMT |
封装 | 900-FCBGA(25x25) |
长度 | 25 mm |
宽度 | 25 mm |
最大主频 | 1.2GHz |
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