AM3352BZCZA100
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Specification
封装 | PBGA-324 |
L1缓存指令存储器 | 32 kB |
工作电压 | 1.325 V |
L1缓存数据存储器 | 32 kB |
ROM大小 | 176 kB |
工作温度范围 | - 40 C~+ 125 C |
内核数量 | 1 Core |
安装方式 | SMD/SMT |
CPU内核 | ARM Cortex A8 |
RAM大小 | 64 kB, 64 kB |
最大主频 | 1 GHz |
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