CD74HCT597MT
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Specification
功能 | 并行至串行 |
安装方式 | 表面贴装型 |
封装 | SOIC-16 |
工作电压 | 4.5V~5.5V |
电路数量 | 1 |
工作温度范围 | -55°C~125°C |
逻辑类型 | 移位寄存器 |
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