MSP430F1121AIDW
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Specification
封装 | SOIC-20 |
高度 | 2.35 mm |
长度 | 12.8 mm |
I/O数量 | 14 I/O |
安装方式 | SMD/SMT |
宽度 | 7.52 mm |
最大主频 | 8 MHz |
RAM大小 | 256 B |
CPU内核 | MSP430 |
ROM类型 | Flash |
ROM大小 | 256 B |
工作电压 | 1.8 V to 3.6 V |
工作温度范围 | - 40 C~+ 85 C |
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