MSP430F123IDW
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Specification
RAM大小 | 256 B |
封装 | SOIC-28 |
工作温度范围 | - 40 C~+ 85 C |
I/O数量 | 22 I/O |
ROM类型 | Flash |
长度 | 18 mm |
ROM大小 | 256 B |
宽度 | 7.52 mm |
CPU内核 | MSP430 |
高度 | 2.35 mm |
最大主频 | 8 MHz |
工作电压 | 1.8 V to 3.6 V |
安装方式 | SMD/SMT |
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