MSP430F2013IPW
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Specification
封装 | TSSOP-14 |
ROM类型 | Flash |
安装方式 | SMD/SMT |
宽度 | 4.4 mm |
A/D | 16 bit |
长度 | 5 mm |
RAM大小 | 128 B |
最大主频 | 16 MHz |
工作电压 | 1.8 V to 3.6 V |
CPU内核 | MSP430 |
工作温度范围 | - 40 C~+ 105 C |
高度 | 1.15 mm |
ROM大小 | 256 B |
I/O数量 | 10 I/O |
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