MSP430G2453IPW0RQ1
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Specification
封装 | TSSOP-20 |
长度 | 6.6 mm |
宽度 | 4.5 mm |
CPU内核 | MSP430 |
工作温度范围 | -40°C~85°C(TA) |
高度 | 1.2 mm |
I/O数量 | 16 |
资格等级 | AEC-Q100 |
安装方式 | SMD/SMT |
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