TLV2473IDGQR
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Specification
封装 | HVSSOP-10 |
压摆率(SR) | 1.5V/µs |
安装方式 | SMD/SMT |
GBP-增益带宽积 | 2.8 MHz |
输出类型 | Rail-to-Rail |
长度 | 3 mm |
宽度 | 3 mm |
电路数量 | 2 Channel |
高度 | 1.02 mm |
Ib - 输入偏流 | 50 pA |
每个通道的输出电流 | 35 mA |
工作温度范围 | - 40 C~+ 125 C |
电源电流 | 600 uA |
电源电压 | 2.7 V~6 V |
CMRR - 共模抑制比 | 64 dB to 84 dB |
放大器类型 | Rail to Rail Amplifier |
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