Part No
Brand
Specification
MPQ|MOQ
Quantity
US Dollar
Delivery Date
Operation
CUI
散热片 TO-220 铝 2.7W @ 75°C 插件板级，垂直
MPQ:1000
MOQ:1
1+
$0.5341
10+
$0.50685
25+
$0.4809
More
10-15
Days
CUI
Batch：2418
Stamped Heat Sink, TO-220, 6.35 mm Horizontal Solder Pin
MPQ:1
MOQ:20
20+
$0.44528
11-14
Days
CUI
Batch：1716
Stamped Heat Sink, TO-220, 6.35 mm Horizontal Solder Pin
MPQ:1
MOQ:332
332+
$0.30657
500+
$0.29865
1000+
$0.28765
More
13-16
Days
CUI
散热片 TO-220 铝 2.6W @ 75°C 插件板级，垂直
MPQ:1000
MOQ:1
1+
$0.5559
10+
$0.52865
25+
$0.50183
More
10-15
Days
Qualcomm / RF360
MPQ:100
MOQ:300
40000+
$0.05512
200000+
$0.05408
400000+
$0.05304
1-3
Days
Qualcomm / RF360
MPQ:100
MOQ:300
40000+
$0.05512
200000+
$0.05408
400000+
$0.05304
1-3
Days
Qualcomm / RF360
MPQ:100
MOQ:300
40000+
$0.05512
200000+
$0.05408
400000+
$0.05304
1-3
Days
Inquiry
| Part No | Quantity | Manufacturer |
|---|---|---|
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