THGBMNG5D1LBAIL
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Specification
存储器类型 | 非易失 |
工作温度范围 | - 25 C~+ 85 C |
安装方式 | SMD/SMT |
封装 | FBGA-153 |
接口类型 | JEDEC/MMCA Version 5.0 |
工作电压 | 2.7V ~ 3.6V |
存储容量 | 4 GB |
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