THGBMNG5D1LBAIL
In stock
- THGBMNG5D1LBAIL Details
- Packing And Shipping
- Payment Method
- Quality Control
Specification
存储器类型 | 非易失 |
工作温度范围 | - 25 C~+ 85 C |
安装方式 | SMD/SMT |
封装 | FBGA-153 |
接口类型 | JEDEC/MMCA Version 5.0 |
工作电压 | 2.7V ~ 3.6V |
存储容量 | 4 GB |
Others include "THGBMNG5D1LBAIL" parts
The following parts include 'THGBMNG5D1LBAIL'
THGBMNG5D1LBAIL Releted Information
- Hot sale
- Related Categories
- Popular Search
FEATURED PRODUCT SOMRON
-
-
THGBMNG5D1LBAIL
Toshiba
Learn More >
-
-
-
THGBMNG5D1LBAIT
Kioxia
eMMC 4GB 15nm eMMC (EEPROM)
Learn More >
-
-
-
THGBMNG5D1LBAIT
Kioxia
NAND Flash Serial e-MMC 3.3V 32G-bit 32G x 1 153-Pin WFBGA
Learn More >
-
-
-
THGBMNG5D1LBAIL
Kioxia
eMMC 4GB 15nm eMMC (EEPROM)
Learn More >
-
-
-
THGBMNG5D1LBAIL
Kioxia
eMMC 4GB 15nm eMMC (EEPROM)
Learn More >
-
-
-
THGBMNG5D1LBAIL
Kioxia
eMMC 4GB 15nm eMMC (EEPROM)
Learn More >
-
-
-
THGBMNG5D1LBAIL
Kioxia
eMMC 4GB 15nm eMMC (EEPROM)
Learn More >
-
- View All Newest Products from Omron