LPC55S69JBD64K
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Specification
工作温度范围 | -40°C~105°C(TA) |
封装 | TQFP-64 裸露焊盘 |
RAM大小 | 320Kx8 |
I/O数量 | 36 |
安装方式 | 表面贴装型 |
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