LPC55S69JBD64K

Name: LPC55S69JBD64K
Brand: NXP
SKU: R001-LPC55S69JBD64K-3-H-2101-X-N
Availability: InStock
Rating: 5 (2 reviews)

Manufacturer:

NXP

Mfr. Part #:

LPC55S69JBD64K

Allchips #:

R001-LPC55S69JBD64K-3-H-2101-X-N

Description:

MCU 32-bit ARM Cortex M33 RISC 640KB Flash 3.3V 64-Pin HTQFP EP Tray

ECAD Model:

Delivery:

Payment:

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LPC55S69JBD64K Details
Packing And Shipping
Payment Method
Quality Control

NXP,LPC55S69JBD64K is available at Allchips.100% original and new guarantee. If comprehensive data for LPC55S69JBD64K to optimize the supply chain, including costdown, time-saving, cross references, parametric, counterfeit risk, alternative components, obsolescence management forecasts is expected, please contact our professional team.

Specification

工作温度范围	-40°C~105°C（TA）
封装	TQFP-64 裸露焊盘
RAM大小	320Kx8
I/O数量	36
安装方式	表面贴装型

	Ship Fee	Lead Time	Processing Time
DHL	$20.00-$40.00(0.50KG)	2-5 days	Shipping fee depend on different zone and country
UPS	$20.00-$45.00(0.50KG)	2-5 days
TNT	$25.00-$65.00(0.50KG)	2-5 days
EMS	$25.00-$45.00(0.50KG)	4-15 days
Air, Sea/air and Sea	$2.00-$3.00(0.10KG)	7-30 days
FedEX	$20.00-$40.00(0.50KG)	3-7 days